标签: 印制板电路

　　PCB设计中专业英译术语之基材： 　　1. 基材：base material 　　2. 层压板：laminate 　　3. 覆金属箔基材：metal-clad bade material 　　4. 覆铜箔层压板：copper-clad laminate (CCL) 　　5. 单面覆铜箔层压板：single-sided copper-clad laminate 　　6. 双面覆铜箔层压板：double-sided copper-clad laminate 　　7. 复合层压板：composite laminate 　　8. 薄层压板：thin laminate 　　9. 金属芯覆铜箔层压板：metal core copper-clad laminate 　　10. 金属基覆铜层压板：metal base copper-clad laminate 　　11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film 　　12. 基体材料：basis material 　　13. 预浸材料：prepreg 　　14. 粘结片：bonding sheet 　　15. 预浸粘结片：preimpregnated bonding sheer 　　16. 环氧玻璃基板：epoxy glass substrate 　　17. 加成法用层压板：laminate for additive process 　　18. 预制内层覆箔板：mass lamination panel 　　19. 内层芯板：core material 　　20. 催化板材：catalyzed board ,coated catalyzed laminate 　　21. 涂胶催化层压板：adhesive-coated catalyzed laminate 　　22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate 　　23. 粘结层：bonding layer 　　24. 粘结膜：film adhesive 　　25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film 　　26. 无支撑胶粘剂膜：unsupported adhesive film 　　27. 覆盖层：cover layer (cover lay) 　　28. 增强板材：stiffener material 　　29. 铜箔面：copper-clad surface 　　30. 去铜箔面：foil removal surface 　　31. 层压板面：unclad laminate surface 　　32. 基膜面：base film surface 　　33. 胶粘剂面：adhesive faec 　　34. 原始光洁面：plate finish 　　35. 粗面：matt finish 　　36. 纵向：length wise direction 　　37. 模向：cross wise direction 　　38. 剪切板：cut to size panel 　　39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 　　40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 　　41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 　　42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 　　43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 　　44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 　　45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 　　46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 　　47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates 　　48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 　　49. 超薄型层压板：ultra thin laminate 　　50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates 　　51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates 　　以上即是PCB设计中专业英译术语之基材，下期预告：PCB设计中专业英译术语之基材的材料，更多更多行业信息可查阅快点学院订阅号：eqpcb_cp。

　　1. 板：board 　　2. 印制板：printed board 　　3. 印制电路：printed circuit 　　4. 印制线路：printed wiring 　　5. 印制线路板：printed wiring board(PWB) 　　6. 印制板电路：printed circuit board (PCB) 　　7. 印制接点：printed contact 　　8. 印制组件：printed component 　　9. 印制板装配：printed board assembly 　　10. 单面印制板：single-sided printed board(SSB) 　　11. 双面印制板：double-sided printed board(DSB) 　　12. 多层印制板：mulitlayer printed board(MLB) 　　13. 多层印制电路板：mulitlayer printed circuit board 　　14. 多层印制线路板：mulitlayer prited wiring board 　　15. 刚性印制板：rigid printed board 　　16. 刚性单面印制板：rigid single-sided printed borad 　　17. 刚性双面印制印制板装配：printed board assembly 　　18. 刚性多层印制板：rigid multilayer printed board 　　19. 挠性多层印制板：flexible multilayer printed board 　　20. 挠性印制板：flexible printed board 　　21. 挠性单面印制板：flexible single-sided printed board 　　22. 挠性双面印制板：flexible double-sided printed board 　　23. 挠性印制电路：flexible printed circuit (FPC) 　　24. 挠性印制线路：flexible printed wiring 　　25. 刚性印制板：flex-rigid printed board, rigid-flex printed board 　　26. 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 　　27. 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 　　28. 齐平印制板：flush printed board 　　29. 金属芯印制板：metal core printed board 　　30. 金属基印制板：metal base printed board 　　31. 多重布线印制板：mulit-wiring printed board 　　32. 陶瓷印制板：ceramic substrate printed board 　　33. 导电胶印制板：electroconductive paste printed board 　　34. 模塑电路板：molded circuit board 　　35. 模压印制板：stamped printed wiring board 　　36. 顺序层压多层印制板：sequentially-laminated mulitlayer 　　37. 散线印制板：discrete wiring board 　　38. 微线印制板：micro wire board 　　39. 积层印制板：buile-up printed board 　　40. 积层多层印制板：build-up mulitlayer printed board (BUM) 　　41. 积层挠印制板：build-up flexible printed board 　　42. 表面层合电路板：surface laminar circuit (SLC) 　　43. 埋入凸块连印制板：B2it printed board 　　44. 多层膜基板：multi-layered film substrate(MFS) 　　45. 层间全内导通多层印制板：ALIVH multilayer printed board 　　46. 载芯片板：chip on board (COB) 　　47. 埋电阻板：buried resistance board 　　48. 母板：mother board 　　49. 子板：daughter board 　　50. 背板：backplane 　　51. 裸板：bare board 　　52. 键盘板夹心板：copper-invar-copper board 　　53. 动态挠性板：dynamic flex board 　　54. 静态挠性板：static flex board 　　55. 可断拼板：break-away planel 　　56. 电缆：cable 　　57. 挠性扁平电缆：flexible flat cable (FFC) 　　58. 薄膜开关：membrane switch 　　59. 混合电路：hybrid circuit 　　60. 厚膜：thick film 　　61. 厚膜电路：thick film circuit 　　62. 薄膜：thin film 　　63. 薄膜混合电路：thin film hybrid circuit 　　64. 互连：interconnection 　　65. 导线：conductor trace line 　　66. 齐平导线：flush conductor 　　67. 传输线：transmission line 　　68. 跨交：crossover 　　69. 板边插头：edge-board contact 　　70. 增强板：stiffener 　　71. 基底：substrate 　　72. 基板面：real estate 　　73. 导线面：conductor side 　　74. 组件面：component side 　　75. 焊接面：solder side 　　76. 印制：printing 　　77. 网格：grid 　　78. 图形：pattern 　　79. 导电图形：conductive pattern 　　80. 非导电图形：non-conductive pattern 　　81. 字符：legend 　　82. 标志：mark