原创 2014: Thinking of Technical Challenge of Hardware Design

2016-2-29 17:03 905 18 18 分类: 消费电子
  • Circuit design: analog circuit, digital circuit
  • Semiconductor: diode, transistor, MOSFET etc.
  • Components selection
  • Power Supply Subsystem
    • AC/DC
    • DC/DC
    • LDO
    • PWM
    • Power Consumption
    • Power Sequence
    • Hot Swap
  • Clocking Subsystem
    • Oscillator/Crystal
    • Buffer and Distributor
  • Reset Subsystem
    • Topology
    • Power on Reset
    • Watchdog
    • Reset Sequence
  • Ethernet Subsystem
    • Switch
    • PHY
    • GMII/SGMII/XAUI/RXAUI/KR/SFI/XFI
    • Transformer/RJ45
    • SFP/XFP
  • NPU/CPU Subsystem(Control Plane)
    • FLASH
    • DRAM, DDR
    • JTAG
  • BSP Software: Register, Driver, Bootloader
  • Thermal Design, Simulation and Test

 

  • High Speed Design

RockyHardware Hierarchy

 

ApplicationSoftware

 

BSP/Driver

 

CPUSystem -Control Plane

 

ASICsystem - Data plane

 

Clock/reset 

powersystem  

 

SoftwareLayer

CircuitLayer

Electromagnetic 

Physics

 

Art/beauty 

 

Standard/protocol

  • Environmental Protection
    • Power Saving
    • Green
    • ROHS/WEEE/REACH
  • Certification
    • CE
    • FCC
    • EMC
    • Safety
  • Reliability
    • Thermal
    • Temperature
    • Shock/Drop

Business

- Price

--Product Cost

-- RDCost

- Time

--Time toMarket ( RD Time, NPI Time)

-- LeadTime

-

 

SupplyChain

-Manufacturers

- Vendors

-Qualification

-Relation

-Quotation

- PaymentTerm

- MOQ

- LeadTime

-Delivery Term

-Sourcing

 

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