原创硬件PCB及PCBA缺陷中英文对照表

 2009-12-30 13:37  2895 13 13 分类: 工程师职场

1板面凹痕	dent	41漏印字符	skip
2内层白斑	I/L white spot	42金粗	Au too big
3线路缺口	circuit nick	43金簿	Au too thin
4蚀刻不净	undering etching	44金手指缺口	G/F voids/nick on G/F
5绿油剥离	S/M peel off	45金手指发黑	G/F too black
6显影不净	under developing	46字符印反	inverse C/M
7基材白点	laminate measling	47金手指针孔	G/F pinholes
8铜面氧化	copper oxide	48标志不清	symbol unclear
9绿油上焊盘	s/m on pad	49标志错	symbol wrong
10白字上焊盘	c/m on pad	50绿油鬼影	ghost in S/M
11阻焊不良	poor S/M	51手指印	finger print
12线路擦花	track scratch	52补线不良	poor line repairing
13锡上线	sn on circuit	53锡高	exessive solder
14聚锡	sn mass	54孔小	hole undersize
15锡灰	sn gray	55字符错	wrong C/M
16焊盘露铜	cu exposed on pad	56字符印偏	C/M misalignment
17锡上金手指	sn on G/F	57字符入孔	C/M in hole
18金手指凹痕	G/F dent	58字符重影	C/M doubloe image
19金手指擦花	G/F scratch	59漏镀金手指	missing plating G/F
20金手指粗糙	G/F roughness	60金手指发白	G/F gray
21v-cut不良	poor V-cut	61焊盘脱落	pad break off/pad peel off
22倒边不良	poor milling	62焊盘露铜	pad expose cu
23针床压伤	ET dent	63断绿油桥	missing S/M bridge
24拖锡不良	poor touch up	64塞孔	block hole
25补金不良	poor repairing Au	65水迹	water print
26补油不良	poor repairing s/m	66锡珠	solder ball
27针孔	pinhole	67砂孔	pitting
28胶渍	paster stain	68油薄
29k孔内毛刺	burrs in hole	69聚油	excess solder mask
30锡珠入孔	solder in hole	70锡粗	Sn too thick
31露铜	expose Cu	71线路上锡	Sn overlap scratch
32露镍	expose Ni	72绿油下杂物	contamination under S/M
33绿油起泡	solder mask blister	73焊盘损坏	land damage
34绿油起皱	solder mask winbles	74焊盘翘起	lifted land
35金手指氧化	G/F oxiding	75偏位	misregistration
36金颜色不良	Au discoloration	76漏钻孔	missing hole
37金面凸起	Au surface blister	77焊盘缺口	nick on pad
38绿油入孔	solder mask in hole	78线路缺口	nick on track
39爆板	board angle damafe
40翘板	warp
1开路	open circuit	46焊盘翘起	lifted land
2短路	short circuit	47漏钻孔	missing hole
线路狗牙	circuit wist	48露布纹	weave exposure
3线路缺口	circuit nick	49钻偏孔	hole misregistratiion
4线路凹痕	circuit dent	50孔损害	hole damage
5渗镀	plating Bloody	51基材分层	delamination
6焊盘缺口	pad nick	52蚀刻过度	over etching
7内层白斑	I/L white spot	53多孔	hole too much
8黑化不良	poor B.O	54残铜	remain Cu
9爆板	measling	55孔内露基材	laminate exposure in hole
10粉红圈	pinking ring	56焊盘脱落	pad break off
11层压起泡	press blister	57焊盘凹痕	pad dent
12错位	misregistation	58焊盘凸起	pad bulge
13偏位	shift	59焊盘损坏	pad damaged
14孔内无铜	no Cu on Pth	60焊盘缺口	pad nick
15孔内毛刺	hole burrs	61焊盘露铜	pad expose Cu
16NPTH有铜	Cu on NPTH	30修理不良	poor repairing
17铜面露基材	exposed laminate	31铜薄	copper too thin
18铜面凹痕	dent on Cu surface	32内层擦花	I/L scratch
19胶渍	gum residue	33内层偏位	I/L misregistation
20夹膜	D/F nip	34内层杂物	I/L inclusions
21蚀刻不尽	under etching	35掉膜	film off
22线幼	line too thin	36干膜碎	D/F meaking
23孔大	hole oversize	37退锡不尽	poor Sn stripping
24孔小	hole undersize	38间隙小	space too marrow
25偏孔	hole misregistration	39板薄	board too thin
26铜面瘤粒	Cu nodule	40板厚	board too thickness
27显影不尽	under developing	41针孔	pinhole
28铜面刮伤	scratch on Cu surface	42崩孔	breakout
29塞孔	hole plugged	43侧蚀	undrcut
45亚色	dull colour	44镀层粗糙	plating layer roughness