原创 BGA测试插座-免焊接设计

IC_BGA sockets - solderless.pdfwww.lingmei.com.cn

BGA/LGA/CGA/QFN/QFP高频测试插座产品分球形出脚(SMT)和针形出脚及接触式三种设计.球形出脚的BGA插座系统主要适用于芯片的测试及开发等.该插座系统的特点是不用在PCB板上开孔,BGA插座的焊接方法和BGA芯片的焊接方法完全一样.同时如果在客户的目标板上BGA Pad旁边如果已经存在一些贴片器件而影响到BGA插座的安装,我们亦提供BGA插座的升高设计以便满足客户的实际要求.。并可根据客户的BGA器件出脚，定制合适的BGA插座(Available for any chip size and grid pattern)。

• Solderless compression type sockets are available for any chip size and grid pattern.

• Easily mounted to the PCB with 4 through hole mounting pegs.

• Solderless compression type sockets are generally supplied with a screw lock retention system.

• Custom versions available.