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最经济实用的BGA/LGA/CGA/CSP芯片测试，开发，替换，维修，升级的解决方案，CPLD/FPGA厂家推荐使用产品
| Over View |
Twist lock sockets are available for any chip size and grid pattern.
Available in SMT, thru-hole and solderless compression type versions.
Compact design.
Custom versions available on request.
 Twist-Lock Type BGA Socket Data Sheet
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MECHANICAL DATA |
Contact life: |
10,000 cycles min. |
Retention System life: |
1,000 cycles min. |
Solderability : |
Exceeds MIL-STD-202 Method 208 |
Individual contact force: |
40 grams max. |
Max. torque for retention
screws: |
up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz to 14 oz-inch |
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| MATERIAL |
Insulator (RoHS Compliant): |
High temp plastic or epoxy FR4 |
Terminal (RoHS compliant): |
Brass |
Contact (RoHS compliant): |
BeCu |
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ELECTRICAL DATA |
Contact resistance: |
< 100 mΩ |
Current rating: |
500 mA max. |
Insulation resistance: |
at 500V DC 100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards |
Breakdown voltage: |
at 60 Hz 500V min. |
Capacitance: |
< 1 pF |
Inductance: |
< 2 nH |
Operating temperature: |
-55°C to +125°C ; 260°C for 60 sec. |
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用户195310 2007-12-6 13:11
Would you please supply the spec of adhesion or bonding strength between BGA pad and its PCB substrate?
TKS~~