verysmallBGAWhite Paper: CoolRunner-II CPLDs R WP165 (v1.0) September 24, 2002 CoolRunner-II Chip Scale Package Details By: Steve Prokosch The CoolRunner-II CPLD family provides two unique CSP (Chip Scale Package options). Xilinx nomenclature defines two types of CSP. They are: CS ― which refers to a 0.8mm ball spacing CP ― which refers to a 0.5mm ball spacing. These packages offer small size and high logic density for both high performance and low power applications. The two CSP discussed in this white paper are the CP56 and CP132 packages. Due to their small ball spacing and associated layout issues, there are certain topics such as solder mask openings and escape routing concerns which are discussed in this white paper. 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered t……