Throwing Power Experience at TP and FP 20050823Throwing Power Experience at Cupracid TP and FP Date: August 23, 2005 February 2002 Kenny Throwing Power Experience Introduction February 2002 Kenny Throwing Power Experience Introduction Cupracid FP is designed for good levelling application Cupracid TP is mainly designed for high quality copper plating process. It produced excellent throwing power and levelling. Both chemistries have been evaluated under the same copper plating tank in Atotech Technical Centre GZ for different customers before. Their throwing power (minimum) results were used for comparison. Unfortunately, the aspect ratio of test boards were different during evaluation. February 2002 Kenny Throwing Power Experience Introduction Test Board dimension during Cupracid FP evaluation: Board Thickness = 1.6 mm an……