BGABall Grid Array (BGA) Packaging exposure. Maintaining proper control of moisture uptake in components is critical to the prevention of "popcorning" of the package body or encapsulation material. BGA components, before shipping, are baked dry and enclosed in a sealed desiccant bag with a desiccant pouch and a humidity indicator card. Most BGA components are classified as a level 3 or level 4 for moisture sensitivity as per the IPC/JEDEC Spec J-STD-020, “Moisture/Reflow Sensitivity Calculation of Plastic Surface Mount Devices.” With most surface mount components, if the units are allowed to absorb moisture beyond their out of bag times for their moisture rating, damage may occur during the reflow process. Chapter 8 of this data book provides an in-depth view of package preconditioning metho……