an_empire-mlfilterNews Release High density packaged RF components: Lumped Elements, Filters, Baluns, Diplexers Passive Components and Circuits The accurate electrical characterization of planar and multi-layered components becomes more and more important in the design of microwave circuits. Only a full 3D-field solver can determine the electromagnetic behavior at high frequencies of junctions, discontinuities, or feedthrus. The Empire software features: Accurate loss modeling with no impact on simulation speed microstrip, triplate, coplanar, coaxial feeds A library of different source excitations, like LTCC multi-layer filter with SMD capctiors on top in a coplanar environment Connectivity check to detect gaps of line pathes in large and complex circuits of intersecting objects which is very useful ……