CMOS Power Amplifiers for Wireless CommunicationsCMOS Power Amplifiers for Wireless Communications
King-Chun Tsai and Paul R. Gray
Berkeley Wireless Research Center Department of Electrical Engineering and Computer Sciences University of California, Berkeley, CA 94720
Integration in Wireless Industry
Cost, Size, Power Reduction Multi-modal Operation, Ubiquitous Connections Service Integration
Hardware Integration
LC filter Discrete Caps Resonators Frequency Synthesizer
Power Amplifier Discrete Inductors Mixer
DSP Memory
For “system-on-a-chip” scale integration, Si technology possibly the only viable choice
Si Technology Roadmap*
Year of product shipment Feature Size TX/RX Frequency (GHz) Fmax/Ft (GHz) Noise Figure (dB) 1/f Noise (V2/HZ-um2)
1997 250 nm
1.8-2.5 25/20
2
1999 180 nm
2.5-3.5 35/30
1.5
2002 130 nm
5.0-7.0 50……
