摘要： 高度集成 78 M 6613 系统芯片 (SoC) 降低了解决方案的印刷电路板 (PCB) 布局设计的复杂性。但是，设计的几个问题需要考虑最佳的测量精度和可靠性。本文讲述了 PCB 拖沓冗长、 晶体振荡器组件、 线电压电阻网络、 分流电流传感器、 两分流电流传感器拓扑、 V3P3 解耦电容器、 电路在仿真器连接器和系统的通信接口。它特别不讨论漏电和间隙。请参阅漏电和 UL 60950-1 中的间隙的探讨。 78M6613 Printed Circuit Board Layout Guidelines A Maxim Integrated Products Brand APPLICATION NOTE AN_6613_050 October 2010 Introduction The highly integrated 78M6613 SOC minimizes the external component count and reduces the complexity of the printed circuit board layout design. However, some design issues require consideration for optimum measurement accuracy and reliability. This application note di……