W2X2.4 — 2x2 Array 4 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch) Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package W2x2.4 (WLCSP 0.4mm Ball Pitch) 2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE SYMBOL MILLIMETERS D A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025 E ……