M24.173C — 24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP) Plastic Packages for Integrated Circuits Package Outline Drawing M24.173C 24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP) Rev 1, 12/09 A 1 3 7.80 ±0.10 4.30 ±0.10 24 13 SEE DETAIL "X" 6.40 PIN #1 3.00 ±0.10……