M14.173B — 14 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP) Plastic Packages for Integrated Circuits Package Outline Drawing M14.173B 14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP) Rev 1, 1/10 A 1 3 5.00 ±0.10 3.10 ±0.10 14 8 SEE DETAIL "X" 6.40 PIN #1 4.40 ±0.10 I.D.……