Tape and Reel Specification for Integrated Circuits Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices (SMD) are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with Electronics Industries Association Standards for “Embossed Carrier Taping of Surface Mount Components for Automatic Handling”. EIA-481 for the . . . . . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and ……