SOT523PDF: 2003 Mar 17
Philips Semiconductors
Package outline
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
non-concave x Eh
q1
Dh D D1 P k view B: mounting base side A2 q2
E
B
q
L2 L
L3
L1
1 Z e DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh e e1
9 w M 0 5 scale e1 e2 k 3 2 L L1 L2 L3 4.5 3.7 m 2.8 P Q q q1 q2 v w x Z(1) 1.65 1.10 10 mm Q m e2 c v M
bp
2.7 0.80 0.58 13.2 2.3 0.65 0.48 12.8
6.2 14.7 3.5 3.5 2.54 1.27 5.08 5.8 14.3
12.4 11.4 6.7 11.0 10.0 5.5
3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6
0.8 0.3 0.02
Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION SOT5……
