相机模组结构图Camera Module Lens : Barrel Lens . Housing : Lens Focusing IR Cut Filter : Glass Image Sensor : CMOS Image Sensor Image Sensor+ISP, Image Sensor only . Substrate() : HPCB, Rigid Flex PCB, Flex PCB, Ceramic, Glass . COB vs COF Camera Module -COB (Chip on Board) : Bare Chip PCB Flexible Board , Wire Bonding Housing Ass’y - COF (Chip on FPCB) : Bare Chip FPCB Flip-chip Bonding Housing Ass’y Structure of AF Module Sensor AF Control chip Micro step Motor , Motor Driver IC Motor Focusing . Edge Detection Motor Motor , Focusing . Phone Baseband chip Software , Baseband . , Module Chip Phone Focusing . Fixed Focus Lens -. Focus Range : 20cm ~ Infinite -. Camera Phone Ratio of Mobile Phone : 2……