W3X3.9C — 3x3 Array 9 Ball Wafer Level Chip Scale Package Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package W3x3.9C (WLCSP 0.4mm Ball Pitch) 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE SYMBOL MILLIMETERS E A 0.445 Min, 0.495 Nom, 0.545 Max A1 0.190 ±0.025 A2 0.305 ±0.025 D b 0.270 ±0.03……