M38.173 — 38 Lead Thin Shrink Small Outline Plastic Package Plastic Packages for Integrated Circuits
Thin Shrink Small Outline Plastic Packages (TSSOP)
N M38.173
38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX 0.25(0.010) M B M
AREA E (COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F)
E1
GAUGE INCHES MILLIMETERS
-B- PLANE
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