intersil的L10.3X3B — 10 铅薄双平面封装（TDFN）
L10.3X3B — 10 Lead Thin Dual Flat Package (TDFN) with E-pad Plastic Packages for Integrated Circuits
Package Outline Drawing
L10.3x3B
10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD
Rev 3, 10/11
5
3.00 A PIN #1 INDEX AREA
B
10 1
5
2.38 +0.1/ - 0.15
……
