intersil的S3X3.9 — 3x3 的OCSP封装信息 Plastic Packages for Integrated Circuits Package Outline Drawing S3x3.9 3X3 ARRAY 9 BUMP OPTICAL CHIP SCALE PACKAGE (OCSP) Rev 7, 10/10 A1 CORNER 2.155 ±0.025 A 1.30 B 0.65 A1 ……