intersil的V416.27X27 — 416 PBGA的封装信息 Plastic Packages for Integrated Circuits Package Outline Drawing V416.27x27 416 PLASTIC BALL GRID ARRAY PACKAGE (CAVITY DOWN) Rev 0, 9/11 0.100 M C 3 PIN A1 CORNER 0.250 M C A B A1 BALL PAD EPOXY ENCAPSULANT ……