XAPP427 - Implementation and Solder Reflow Guidelines for Pb-Free Packages Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee XAPP427 (v2.5) February 4, 2010 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of the electronics industry. The Pb-free……