Standard = .010” (250 μm) Hole-to-Copper Imaging - Front-to-Back = +/- .002” (50 μm) Lamination - layer-to-layer registration = +/- .004” (100 μm) Drill - Drill tolerance = +/- .003” (75 μm) Total Tolerance = .009” (225 μm) Advanced = .008” (200 μm) Hole-to-Copper Imaging - Front-to-Back = +/- .002” (50 μm) Lamination - layer-to-layer registration = +/- .003” (75 μm) Drill - Drill tolerance = +/- .002” (50 μm) Total Tolerance = .007” (175 μm)