本应用笔记的目的是为在客户介绍了裸片处理的装配 AN10706
Handling bare die
Rev. 02 ― 10 June 2011 Application note
Document information
Info Content
Keywords bare die, handling, ESD, clean room, mechanical damages, delivery
forms, transport conditions, store conditions
Abstract This application note is intended for introducing customers in assembly
technologies requiring bare die handling.The aim of this document is to
rise the sensitivity and awareness of special physical effects which could
harm the quality and yield of the production.
NXP Semiconductors ……
