手机摄像模组的制作流程Agenda 1. 2. 3. 4. 1. Substrate Image Sensor (Holder) IR Cut DSP or IC Flex Cable (FPC) Image Sensor Sensor SMT , PLCC/CLCC , (Lens Holder) Sensor bare die chip scale Substrate , (Lens Holder) ACF Hot Bar Double Sided Substrate Based Ceramic Substrate Based Gold Finger Connector B-To-B Connector 2. Wire Bonding CSP Flip Chip FPC #1 ……