W3X4.12 — 3x4 Array 12 Ball Wafer Level Chip Scale Package (WLCSP) Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch) W3x4.12 D 3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE SYMBOL MILLIMETERS A 0.445 Min 0.495 Nom 0.545 Max E A1 0.190 ±0.025 A2 0.305 ±0.025 ……