M38.173C — 38 Lead Heat-Sink Thin Shrink Small Outline Plastic Package (HTSSOP) Plastic Packages for Integrated Circuits
Package Outline Drawing
M38.173C
38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP)
Rev 0, 4/10
B PIN 1 ID 4.6±0.10
D 0.09-0.20
3 2 1 12 3
6.4 C
L 3.……
