M28.209 — 28 Lead Shrink Small Outline Plastic Package Plastic Packages for Integrated Circuits
Shrink Small Outline Plastic Packages (SSOP)
N M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA H 0.25(0.010) M B M
INCHES MILLIMETERS
E
GAUGE SYMBOL MIN MAX MIN MAX NOTES
-B- ……
