【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices This application note describes the thermal composite flip chip molded ball-grid array (FCmBGA) package for the Arria V device family. FCmBGA improves board real-estate use by allowing closer spacing between passive components and the flip chip die, providing better warpage control for thin core substrates, and improving solder joint reliability. Thermal Management and Mechanical Handling for Altera FCmBGA Devices AN-657-1.0 Application Note This application note describes the thermal composite flip chip molded ball-grid array (FCmBGA) package for the Arria V device family. FCmBGA improves board real-estate use by allowing closer spacing between passive components and the flip chip die, providing better warpage control for thin core ……