XCN07025 - Package Substrate Change for Select Virtex-5 LX Devices Package Substrate Change
for Select Virtex-5 LX Devices
XCN07025 (v1.0.1) March 11, 2008 Product/Process Change Notice
Overview
The purpose of this notification is to communicate a 10-layer package substrate change for select Virtex-5 LX devices.
Description
LX devices in packages greater than 1000 pins will begin transitioning to 10-layer package substrate, as part of the Xilinx
material standardization for the Virtex-5 family. This change is backward-compatible with current production devices. This
change will not affect the……
