LAYOUT REPORT .................................................................................................................. 1
目录........................................................................................................................................... 1
1. PCB LAYOUT 术语解释(TERMS)......................................................................................... 2
2. Test Point : ATE 测试点供工厂ICT 测试治具使用.................................................... 2
3. 基准点 (光学点) -for SMD:........................................................................................... 4
4. 标记 (LABEL ING)............................................................................................................. 5
5. VIA HOLE PAD..................................................................................................................... 5
6. PCB Layer 排列方式.......................................................................................................... 5
7.零件佈置注意事项 (PLACEMENT NOTES)........................................................................... 5
8. PCB LAYOUT 设计................................................................................................................ 6
9. Transmission Line ( 传输线 )..................................................................................... 8
10.General Guidelines – 跨Plane.................................................................................. 8
11. General Guidelines – 绕线....................................................................................... 9
12. General Guidelines – Damping Resistor............................................................. 10
13. General Guidelines - RJ45 to Transformer......................................................... 10
14. Clock Routing Guideline........................................................................................... 12
15. OSC & CRYSTAL Guideline........................................................................................... 12
16. CPU