LAYOUT REPORT .................................................................................................................. 1 目录........................................................................................................................................... 1 1. PCB LAYOUT 术语解释(TERMS)......................................................................................... 2 2. Test Point : ATE 测试点供工厂ICT 测试治具使用.................................................... 2 3. 基准点 (光学点) -for SMD:........................................................................................... 4 4. 标记 (LABEL ING)............................................................................................................. 5 5. VIA HOLE PAD..................................................................................................................... 5 6. PCB Layer 排列方式.......................................................................................................... 5 7.零件佈置注意事项 (PLACEMENT NOTES)........................................................................... 5 8. PCB LAYOUT 设计................................................................................................................ 6 9. Transmission Line ( 传输线 )..................................................................................... 8 10.General Guidelines – 跨Plane.................................................................................. 8 11. General Guidelines – 绕线....................................................................................... 9 12. General Guidelines – Damping Resistor............................................................. 10 13. General Guidelines - RJ45 to Transformer......................................................... 10 14. Clock Routing Guideline........................................................................................... 12 15. OSC & CRYSTAL Guideline........................................................................................... 12 16. CPU