lecture for semiconductor packaging method. to understand package material, process, design ect.Semiconductor Packaging Number of Lectures: 2 Learning Objectives: To appreciate the need for a variety of semiconductor packages, and the characteristics that influence the selection of package for an application. At the end of the Module the student should be able to: To understand the need for and the availability of a large variety of packages at the chip level. To understand the characteristics of single chip packages and their influence on the system construction and performance To appreciate the criteria according to which a chip level package is selected. To have an appreciation of different interconnection technologies used in single chip packages. To have an overall appreciation of materials issues in chip level packaging To become fami……