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官方资料-philips转NXP后包装的变化
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类别: 制造与封装
时间:2020-01-06
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官方资料-philips转NXP后包装的变化Packing and label changes related to the new brand and trade name NXP Semiconductors Attachment to the Advance and Final CPCN issued on October 6th, 2006 Introduction On October 1st, NXP Semiconductors has become the new brand name and trade mark for former Philips Semiconductors. As a consequence in the near future our deliveries will change to reflect NXP name/logo. Following aspects of our deliveries are subject to change: 1. Marking of all our packaged products and backside marking of bumped dice, that currently have Philips logo or "PH" in characters. 2. PQ boxes & labels on PQ boxes. 3. Tubes (where applicable). All above changes will be synchronized, so a delivery will either display "Philips" or "NXP" on all above mentioned aspects. Philips indication on naked dice, TCP & COF ……
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