Structure of conventional package 传统封装结构
Failure ClassificationPhysical Failure (Structure)- Popcorn- Delamination- Crack (Package/Die)Electrical Failure (Connection)- Open- Short- Leakage- FunctionIn-Process Failure (Production)- Front-end (before molding)- Back-end (After molding)- Testing (FT/Burn-in)Reliability Failure (Qualification)- Temperature- Humidity- Pressure- Voltage
Popcorn (爆裂)
TQFP package (bottom popcorn)
FBGA package (top popcorn)
Delamination (离裂)
Crack (破裂)
Assembly Flow 装配流程
Wiring Bondability (TSOP/BGA)
Inner Lead Bondability (TCP/COF) 内部引线可焊性（TCP/COF）
Bondability (Bonding Force) 可结合性，可焊性（结合力）
X-RAY Inspection (NDT)
2nd BondingBroken
Open Failure
Short Failure
Short Failure (Tin Whisker)
Short Failure
Leakage Failure
Function Failure
Assembled Related – Machine/Man Damaged
Assembled Related – Environment (Particle Damaged)
ESD Cases of Driver ICs
Difference between ESD and EOS
Major Mode of Damages by ESD
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