半导体晶圆集成电路故障模式及失效案例分析
0 2023-11-23



Structure of conventional package 传统封装结构

Failure ClassificationPhysical Failure (Structure)- Popcorn- Delamination- Crack (Package/Die)Electrical Failure (Connection)- Open- Short- Leakage- FunctionIn-Process Failure (Production)- Front-end (before molding)- Back-end (After molding)- Testing (FT/Burn-in)Reliability Failure (Qualification)- Temperature- Humidity- Pressure- Voltage

Popcorn (爆裂)

TQFP package (bottom popcorn)

FBGA package (top popcorn)

Delamination (离裂)

Crack (破裂)

Assembly Flow 装配流程

Wiring Bondability (TSOP/BGA)

Inner Lead Bondability (TCP/COF) 内部引线可焊性(TCP/COF)

Bondability (Bonding Force) 可结合性,可焊性(结合力)

X-RAY Inspection (NDT)

2nd BondingBroken

Open Failure

Short Failure

Short Failure (Tin Whisker)

Short Failure

Leakage Failure

Function Failure

Assembled Related – Machine/Man Damaged

Assembled Related – Environment (Particle Damaged)

ESD Cases of Driver ICs

Difference between ESD and EOS

Major Mode of Damages by ESD



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